CHIPS R&D National Advanced Packaging Manufacturing Program: Materials & Substrates

Program Overview       

On February 28, 2024, the Department of Commerce announced the availability of $300,000,000 in R&D funding under the National Advanced Packaging Manufacturing Program (NAPMP). The purpose of the NAPMP program is to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors. Advanced packaging achieves far greater function, performance, and power savings than can be achieved with conventionally packaged chips on a printed circuit board.

The Department aims to enable the development of a robust domestic advanced packaging ecosystem by investing in four hardware-related development areas: 1) Materials and Substrates, 2) Equipment, Tools, and Processes, 3) Power Delivery and Thermal Management, and 4) Photonics and Connectors. Project activities are can include, but are not limited to, basic and applied research, substrate and demonstration device development and production, commercial viability and domestic production preparation, integrated education and workforce development and pilot-level substrate production.

Objectives

The NAPMP program seeks to achieve the following objectives:

• Accelerate domestic R&D and innovation in advanced packaging materials and substrates;

• Translate domestic materials and substrate innovation into U.S. manufacturing, such that these technologies are available to U.S. manufacturers and customers, including to significantly benefit U.S. economic and national security;

• Support the establishment of a robust, sustainable, domestic capacity for advanced packaging materials and substrate R&D, prototyping, commercialization, and manufacturing; and

• Promote a skilled and diverse pipeline of workers for a sustainable domestic advanced packaging industry.

The NAPMP program seeks applications relevant to one or more of the following technical areas: 

• Technical Area 1 (TA1): Organic materials and substrates (including fan-out)

• Technical Area 2 (TA2): Glass materials and substrates

• Technical Area 3 (TA3): Semiconductor-based substrates

Eligibility    

Eligible Applicants include: 

• Domestic for-profit and non-profit organizations

• Institutions of higher education including community and technical colleges

• State, local, territorial, and Indian tribal governments

Cost Share: not required, but preference given to applications with co-investment

Key Dates 

Informational Webinar: March 1, 2024, at 3pm ET

Concept Paper Due Date: April 12, 2024

Full Application Due Date: July 3, 2024

Resources 

View the opportunity on grants.gov here.

View the program website here.

Attend the Webinar (participants must register here.)